Our Capabilities

Our capabilities cover all aspects of embedded product engineering, some of the common aspects are as follows:

Hardware

µC, µP (ARM/MIPS/PPC/DSP/INTL/PXA), FPGA/CPLD/PAL, c/PCI/e, Transducer (MEMS etc.) and/or DSP Based Board Design

Firmware

BSP and Device Drivers for WinCE, Linux, Windows, RTOS Based Systems

Middleware

Expertise in Wireless Communication Protocols;

Performance, Power and Battery Management, A/V CODECS;

Digital Aquisition and Signal Processing

Application

Usability and Safety Driven Design of Interfaces

Design

Design of Highly Available and Distributed, RT and Embedded Systems

Process

Expert Understanding of Regulatory Compliance Processes (FDA, Security, Safety)

Production

EMI/EMC, Environmental (e-Mechanical, e-Physical, e-Chemical)  and Regulatory Compliant Design and Manufacturing

Tools

HW (FPGA, Board, ICE, Analyzers), SW (IDE, Tool Chains, SCM), Productivity Tools